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Texas Instruments Announces Availability of EPC Generation 2 RFID Silicon

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[08/01/06]
Using an advanced silicon design that improves tag performance and facilitates speed and visibility of retail supply chain goods, Texas Instruments announced the availability of its EPC Gen 2 ultra-high frequency (UHF) silicon.

Offered in wafer and strap form factors, TI has developed its Gen 2 silicon on the most advanced analog process node at 130 nanometer and with a built-in Schottky diode for more efficient conversion of radio frequency (RF) signal energy. The result is silicon chips with low power consumption and increased chip-to-reader sensitivity. Users can also write to TI's chips under the lowest RF power conditions in spite of background electromagnetic interference (EMI) common in typical supply chain factory floor and warehouse environments.

Companies deploying UHF-based RFID systems based on TI's Gen 2 technology can potentially capture a greater percentage of reads on cases and pallets as they move through manufacturing and distribution channels. With improved chip-to-reader sensitivity, companies can expect to more accurately track products and packages at all points throughout their supply chain operations and improve process flow. TI's chip also delivers reliable read range performance across both standard and dense reader mode operations. As a result, users are less constrained in the set-up and placement of RFID readers and can more readily achieve effective results and maximum read rates.

Offering greater design flexibility to customers, TI is providing its Gen 2 silicon to inlay, label and packaging manufacturers in three convenient forms: bare wafers to support various assembly processes; processed wafers (bumped, sawn with back grind) that are suitable for immediate use with commercially available inlay equipment; and silicon chip on straps for label and packaging manufacturers who are printing their own antennas. TI is also offering reference antenna designs enabling customers to develop labels and tags which optimize its Gen 2 silicon.

"Users of EPC Gen 2 tags, from box and label manufacturers to distributors of consumer product goods, have different needs and expectations from RFID systems that power their supply chains. With TI technology, they can take advantage of the form factor that is best suited for their manufacturing flow," said Tony Sabetti, director of UHF/Retail Supply Chain, Texas Instruments RFID Systems. "TI's Gen 2 chip is available in a variety of form factors that users will find convenient and flexible."

TI's Gen 2 silicon is intended for use in the manufacture of passive RFID tag products operating in the 860 to 960 MHz. frequency band. Meeting all of the EPCglobal Gen 2 and ISO/IEC 18000-6c required specifications with 192 bits of memory, this chip also goes beyond the standard requirements to provide additional functionality by supporting "block write" and "block erase" commands.

About Texas Instruments

Texas Instruments is the world's largest integrated manufacturer of RFID transponders and reader systems. Capitalizing on its competencies in high-volume semiconductor manufacturing and microelectronics packaging, TI is a visionary leader and at the forefront of establishing new markets and international standards for RFID applications. For more information, contact TI-RFid Systems at 1-800-962-7343 (North America) or +1 214-567-7343 (International), or visit the Web site at www.ti-rfid.com.

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. TI is headquartered in Dallas , Texas , and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com.


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